Dual Damascene: a ULSI wiring technology
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- A four-level-metal fully planarized interconnect technology for dense high performance logic and SRAM applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Improved CVD aluminum deposition using in-situ sputtered nucleation layersPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Submicron wiring technology with tungsten and planarizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1987