Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 40 (12), 2228-2234
- https://doi.org/10.1109/22.179884
Abstract
No abstract availableKeywords
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