Mechanical Properties of Thin Ag Films on a Silicon Substrate Studied Using the Nanoindentation Technique

Abstract

The mechanical properties of thin Ag films of equal thickness containing grains of various sizes were studied. The film hardness was measured using the Oliver-Pharr techniques based on indentation work calculations or on direct measurements of the area of pyramid imprints in AFM images. In order to avoid the influence of a substrate on the measured hardness, a technique was developed to determine the true values of the film hardness. It was established that the hardness of Ag films decreases with an increase in mean grain size, whereas the elastic modulus remains almost unchanged. It was shown that the dependence of the yield stress of Ag films on grain size does not obey the classical Hall-Petch law.