A novel multichip module assembly approach using gold ball flip-chip bonding
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (4), 457-464
- https://doi.org/10.1109/33.159874
Abstract
No abstract availableThis publication has 5 references indexed in Scilit:
- Multichip modules: next-generation packagesIEEE Spectrum, 1990
- Multi-layer thin-film substrates for multi-chip packagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Multichip thin-film technology on siliconIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1989
- Enhancing Ultrasonic Bond DevelopmentIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1978
- Metallurgical Failure Modes of Wire Bonds8th Reliability Physics Symposium, 1974