Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
Top Cited Papers
- 1 July 2000
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 48 (12), 3261-3269
- https://doi.org/10.1016/s1359-6454(00)00128-2
Abstract
No abstract availableThis publication has 34 references indexed in Scilit:
- Plastic Deformation in Thin Copper Films Determined by X-Ray Micro-Tensile TestsMRS Proceedings, 1996
- Measurement of Young's Modulus and Poisson's Ratio of Free-Standing Ag/Cu Multilayered Thin FilmsMRS Proceedings, 1995
- The study of grain size dependence of yield stress of copper for a wide grain size rangeActa Metallurgica et Materialia, 1994
- On dislocation storage and the mechanical response of fine scale microstructuresActa Metallurgica et Materialia, 1994
- The elastic biaxial modulus of Ag–Pd multilayered thin films measured using the bulge testJournal of Materials Research, 1994
- A new method for tensile testing of thin filmsJournal of Materials Research, 1993
- A new bulge test technique for the determination of Young's modulus and Poisson's ratio of thin filmsJournal of Materials Research, 1992
- A modified model for hall-petch behavior in nanocrystalline materialsScripta Metallurgica et Materialia, 1992
- On the validity of the hall-petch relationship in nanocrystalline materialsScripta Metallurgica, 1989
- The Elastic Constants of a Solid containing Spherical HolesProceedings of the Physical Society. Section B, 1950