Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal Shock

1 April 1987

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

No. 07350791,p. 238-249
https://doi.org/10.1109/irps.1987.362185

Abstract

A test chip was used to compare thin film cracking of various circuit layouts at various positions on the chip, and to study wire ball shear. Slotted aluminum busses reduced thin film cracking in die corners. Thin film cracking and wire ball shear failure rates have remarkably different dependence on shock versus cycle and on lead frame material.

Keywords

PLASTIC FILMS
WIRE
TEMPERATURE
ELECTRIC SHOCK
PASSIVATION
ALUMINUM
RESISTORS
THIN FILM CIRCUITS
CIRCUIT TESTING
PACKAGING

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