Thermodynamic modelling of a solid state thermoelectric cooling device: Temperature–entropy analysis
- 1 September 2006
- journal article
- Published by Elsevier in International Journal of Heat and Mass Transfer
- Vol. 49 (19-20), 3547-3554
- https://doi.org/10.1016/j.ijheatmasstransfer.2006.02.047
Abstract
No abstract availableKeywords
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