Systematic procedures for digital system realization from logic design to production

Abstract

A simple, systematic procedure is presented for converting Integrated Circuit Packages (ICP's) and logical designs, first to test breadboards and prototypes and later through ascending packaging compatibility to production models. Emphasis is placed on a minimum number of human decisions, rapid design turnaround time, and available techniques using minimum cost capital equipment. The basic procedure produces two-layer printed circuit boards. A simple extension allows direct conversion to a high density multi-layer system.