A bulk silicon dissolved wafer process for microelectromechanical devices
- 1 June 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in Journal of Microelectromechanical Systems
- Vol. 1 (2), 77-85
- https://doi.org/10.1109/84.157361
Abstract
No abstract availableKeywords
This publication has 18 references indexed in Scilit:
- A novel technique and structure for the measurement of intrinsic stress and Young's modulus of thin filmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Sub-micron gaps without sub-micron etchingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Deep dry etching techniques as a new IC compatible tool for silicon micromachiningPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Cross-sectional TEM studies of heavily boron-doped siliconPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Micromechanical structures for thin film characterizationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Surface micromachined structures fabricated with silicon fusion bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A bulk silicon dissolved wafer process for microelectromechanical systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High aspect ratio electroplated microstructures using a photosensitive polyimide processPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1992
- Feature‐Size Dependence of Etch Rate in Reactive Ion EtchingJournal of the Electrochemical Society, 1991
- An ultraminiature solid-state pressure sensor for a cardiovascular catheterIEEE Transactions on Electron Devices, 1988