An Improved Sing-Around System for Ultrasonic Velocity Measurements
- 1 December 1960
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IRE Transactions on Instrumentation
- Vol. I-9 (3), 359-367
- https://doi.org/10.1109/ire-i.1960.5006950
Abstract
No abstract availableKeywords
This publication has 7 references indexed in Scilit:
- Dislocation Contributions to the Modulus and Damping in Copper at Megacycle FrequenciesJournal of Applied Physics, 1961
- Modifications to Standard Pulse Techniques for Ultrasonic Velocity MeasurementsThe Journal of the Acoustical Society of America, 1959
- Thermal expansion of lead at low temperaturesPhilosophical Magazine, 1958
- Low-Temperature Thermal Expansion of CopperPhysical Review B, 1957
- Ultrasonic Attenuation at Low Temperatures for Metals in the Normal and Superconducting StatesThe Journal of the Acoustical Society of America, 1956
- Electronic Pulse Method for Measuring the Velocity of Sound in Liquids and SolidsThe Journal of the Acoustical Society of America, 1954
- LI.Change of length of ferromagnetic substances under high and low temperatures by magnetizationJournal of Computers in Education, 1903