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Micromachined silicon conformal packaging for millimeter wave system applications
Home
Publications
Micromachined silicon conformal packaging for millimeter wave system applications
Micromachined silicon conformal packaging for millimeter wave system applications
LK
L.P.B. Katehi
L.P.B. Katehi
RK
R.T. Kihm
R.T. Kihm
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27 November 2002
proceedings article
Published by
Institute of Electrical and Electronics Engineers (IEEE)
p.
247
https://doi.org/10.1109/epep.1998.734034
Abstract
No abstract available
Keywords
CHIP
FLIP CHIP
MIMIC
AG
ISOLATION
RADIO FREQUENCY
SI
PRODUCTION
PACKAGING
MICROMACHINING
FABRICATION
MILLIMETER WAVE
SILICON
INTEGRATED CIRCUIT PACKAGING
Cited by 1 article