Resistivity of bias-sputtered TiW films
- 1 November 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 64 (1), 17-23
- https://doi.org/10.1016/0040-6090(79)90536-4
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
- Studies of the Ti-W/Au metallization on aluminumThin Solid Films, 1978
- Application of Ti: W barrier metallization for integrated circuitsThin Solid Films, 1978
- Metallization in microelectronicsThin Solid Films, 1977
- Influence of Surface Absorption Characteristics on Reactively Sputtered Films Grown in the Biased and Unbiased ModesJournal of Applied Physics, 1972
- Stress and resistivity control in sputtered molybdenum films and comparison with sputtered goldMetallurgical Transactions, 1971
- Corrosion Resistance of Several Integrated-Circuit Metallization SystemsIEEE Transactions on Reliability, 1970
- Thin Films Deposited by Bias SputteringJournal of Applied Physics, 1965