3D characterization of air bridges and via holes in conductor-backed coplanar waveguides for MMIC applications
- 31 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
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This publication has 3 references indexed in Scilit:
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- Application of the three-dimensional finite-difference time-domain method to the analysis of planar microstrip circuitsIEEE Transactions on Microwave Theory and Techniques, 1990
- Numerical solution of initial boundary value problems involving maxwell's equations in isotropic mediaIEEE Transactions on Antennas and Propagation, 1966