Improved distributed model for capacitors in high-performance packages
- 25 June 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 969-976
- https://doi.org/10.1109/ias.2002.1042675
Abstract
Time-domain and frequency-domain measurements show that a simple lumped RLC model for a multilayer ceramic capacitor is inade- quate, overestimating high-frequency impedance by a factor of five. A lossy transmission-line model works better, and is improved by placing incremen- tal resistance in series with the incremental capacitance. Refinements of this model are developed based on time-domain step-response measurements and on frequency-domain impedance measurements. Better packaging to reduce series inductance is discussed.Keywords
This publication has 10 references indexed in Scilit:
- Impedance-analyzer measurements of high-frequency power passives: techniques for high power and low impedancePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- A new technique for high frequency characterization of capacitorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Distributed SPICE circuit model for ceramic capacitorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A physical method to incorporate parasitic elements in a circuit simulator based on the partial inductance conceptPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A technique for the characterization of multi-terminal capacitors for high frequency applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- High frequency model for power electronics capacitorsIEEE Transactions on Power Electronics, 2001
- Fundamentals of Power ElectronicsPublished by Springer Nature ,2001
- Minimization of the stray inductance in metallized capacitors: Connections and winding geometry dependenceThe European Physical Journal Applied Physics, 1998
- High frequency measurement of multilayer ceramic capacitorsIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B, 1996
- Magnetic field and current distribution in metallized capacitorsJournal of Applied Physics, 1994