Abstract
A technique using a vibrating cathode has been developed to study the factors that influence particle-cathode adhesion during codeposition. It has been possible to distinguish between the forces that operate at the instant of particle-cathode contact and the time-dependent adhesion that is developed as a result of metal deposition. The rate of development of a bond due to metal deposition has been directly related to metal ion adsorption on the particle surface in both copper-alumina and nickel-alumina systems. The addition of chloride ions to the copper-alumina system has been found to affect the rate at which alumina is codeposited; this effect is negated by the addition of thallium ions.