The Influence of Several Design and Material Variables on the Propensity for Solder Joint Cracking
- 1 December 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (4), 296-304
- https://doi.org/10.1109/tphp.1975.1135080