On the scribing and subsequent fracturing of silicon semiconductor wafers
- 1 November 1979
- journal article
- Published by Springer Nature in Journal of Materials Science
- Vol. 14 (11), 2567-2574
- https://doi.org/10.1007/bf00610624
Abstract
No abstract availableKeywords
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- The Stress Field Created by a Circular Sliding ContactJournal of Applied Mechanics, 1966