Relaxations in thermosets. VI. Effects of crosslinking on sub‐Tg relaxations during the curing and aging of epoxide‐based thermosets
- 11 March 1991
- journal article
- research article
- Published by Wiley in Journal of Polymer Science Part B: Polymer Physics
- Vol. 29 (4), 437-449
- https://doi.org/10.1002/polb.1991.090290406
Abstract
No abstract availableKeywords
This publication has 29 references indexed in Scilit:
- Relaxations in thermosets. 7. Dielectric effects during the curing and postcuring of an epoxide by mixed aminesMacromolecules, 1990
- Epoxy resins (DGEBA): The curing and physical aging processJournal of Polymer Science Part B: Polymer Physics, 1990
- Relaxations of thermosets. III. Sub‐Tg dielectric relaxations of bisphenol‐A–based epoxide cured with different cross‐linking agentsJournal of Polymer Science Part B: Polymer Physics, 1990
- Highly crosslinked polymersProgress in Polymer Science, 1989
- Study of structural relaxation by dynamic-mechanical methods in poly(methyl methacrylate)Polymer, 1989
- Dielectric studies of the effects of thermal history on secondary relaxation in bisphenol‐a‐polycarbonateJournal of Polymer Science Part B: Polymer Physics, 1989
- The effect of water on dielectric relaxations in the glassy states of poly(propylene oxide) and propylene glycolPolymer, 1988
- Dynamic mechanical behaviour and its dependence on preparation method of structural epoxide resinPolymer, 1987
- Mechanical and dielectric relaxations of epoxide resins containing the spiro‐ring structure. II. Effect of the introduction of methoxy branches on low‐temperature relaxations of epoxide resinsJournal of Polymer Science Part B: Polymer Physics, 1987
- Analysis of dielectric loss data using the Williams–Watts functionThe Journal of Chemical Physics, 1985