Interpretation of thermal grooving data for copper
- 1 January 1970
- journal article
- research article
- Published by Springer Nature in Metallurgical Transactions
- Vol. 1 (1), 313-315
- https://doi.org/10.1007/bf02819284
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Comments on the Use of Log‐Log Plots in Analyzing Grain Growth DataJournal of the American Ceramic Society, 1968
- Diffusion Sintering: II, Initial Sintering Kinetics of AluminaJournal of the American Ceramic Society, 1963
- The kinetics of grain boundary grooving in copperActa Metallurgica, 1959
- Theory of Thermal GroovingJournal of Applied Physics, 1957
- Self-Diffusion in CopperPhysical Review B, 1954