The Structure of Electroplated and Vapor-Deposited Copper Films

Abstract

The structures of electroplated and vapor‐deposited copperfilms have been studied by x‐ray diffraction. While there was no evidence of stacking faults in any of these films, the electroplated films were characterized by presence of twins, large thickness‐dependent microstrains, and small particle sizes. The vapor‐deposited films, on the other hand, showed no twins, smaller microstrains, and large thickness‐dependent particle sizes. Analysis of the electrical resistivity of the electroplated films indicated that the twin resistivity of copper is, at most, half of the grain‐boundary resistivity.