A stabilized tantalum diffusion barrier for the gold metallization system
- 1 February 1974
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 3 (1), 25-35
- https://doi.org/10.1007/bf02654544
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Structure and thermal stability of sputtered Au–Ta filmsJournal of Applied Physics, 1973
- Solid Solution Effects in Thin Aluminum FilmsJournal of Vacuum Science and Technology, 1970
- Expanded contacts and interconnexions to monolithic silicon integrated circuitsSolid-State Electronics, 1965
- Temperature Coefficients of Resistance of Metallic Films in the Temperature Range 25° to 600°CJournal of Applied Physics, 1959
- Quantitative X-ray diffraction observations on strained metal aggregatesProgress in Metal Physics, 1952