Curving monolithic silicon for nonplanar focal plane array applications

Abstract

Despite progress in the performance of image sensors, comparatively little work has focused on overcoming the limitations of planar image sensor arrays. We present a technique to construct curved monolithic silicon structures that can be processed using standard silicon processing prior to curving. The process relies on microstructuring of a monolithic silicon die using a deep reactive ion etch process. This technique can be used to build curved integrated circuits such as image sensors for more compact cameras with improved optical performance.