Internal thermal resistance of a multi-chip packaging design for VLSI-based systems

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6 January 2003

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

https://doi.org/10.1109/ecc.1988.12607

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Multi-chip packaging technology for VLSI-based systems
Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987

Cited by 14 articles