Aging properties of gold layers with different adhesion layers
- 1 September 1976
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 37 (3), 335-343
- https://doi.org/10.1016/0040-6090(76)90603-9
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Cinetique de precipitation des lacunes lors de la formation des tetraedres de faute d'empilement dans l'or trempeActa Metallurgica, 1975
- The stacking-fault energy of gold and silverPhilosophical Magazine, 1964
- Electrical Resistivity Study of Lattice Defects Introduced in Copper by 1.25-Mev Electron Irradiation at 80°KPhysical Review B, 1956