Intermetallic Growth Dependence on Solder Composition in the System Cu‐(Pb‐Sn Solder)
- 1 October 1981
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 128 (10), 2165-2166
- https://doi.org/10.1149/1.2127209