The dependence of deposition rate on power input for dc and rf magnetron sputtering
- 1 January 1981
- Vol. 31 (7), 315-317
- https://doi.org/10.1016/s0042-207x(81)80503-9
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Discharge characteristics for magnetron sputtering of Al in Ar and Ar/O2 mixturesJournal of Vacuum Science and Technology, 1980