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Stress-induced grain boundary fractures in Al–Si interconnects
Home
Publications
Stress-induced grain boundary fractures in Al–Si interconnects
Stress-induced grain boundary fractures in Al–Si interconnects
KH
K. Hinode
K. Hinode
NO
N. Owada
N. Owada
TN
T. Nishida
T. Nishida
KM
K. Mukai
K. Mukai
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1 March 1987
journal article
Published by
American Vacuum Society
in
Journal of Vacuum Science & Technology B
Vol. 5
(2)
,
518-522
https://doi.org/10.1116/1.583942
Abstract
No abstract available
Keywords
GRAIN BOUNDARY
Cited by 110 articles