Electrical conduction models for isotropically conductive adhesive joints
- 1 March 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 20 (1), 3-8
- https://doi.org/10.1109/95.558537
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- Reliability and failure mechanism of isotropically conductive adhesives jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Electrical, structural and processing properties of electrically conductive adhesivesIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1993
- Resistivities of conductive compositesJournal of Applied Physics, 1992
- Temperature-dependent resistivity and conduction mechanism in carbon particle-filled polymersJournal of Materials Science, 1992
- Formulation of silver loaded manganite based thermistor paste and application of percolation theory for sudden transition in conductanceJournal of Applied Physics, 1988
- Effect of fillers on electrical properties of epoxy compositesJournal of Applied Polymer Science, 1988
- Temperature effect on the electrical resistivity of metal/polymer compositesPolymer Engineering & Science, 1978
- Ionic polarization and electronic conduction in carbon-black-filled polyvinylchlorideJournal of Applied Physics, 1975
- Percolation and conductivity: A computer study. IPhysical Review B, 1974
- Percolation and ConductionReviews of Modern Physics, 1973