Microstructural analysis and tensile properties of thick copper and nickel sputter deposits
- 1 January 1977
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 40, 345-353
- https://doi.org/10.1016/0040-6090(77)90136-5
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
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- Room-Temperature Recrystallization in Thick Bias-Sputtered Copper DepositsJournal of Applied Physics, 1971