A 36-chip multiprocessor multichip module made with the General Electric high density interconnect technology
- 9 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 12 references indexed in Scilit:
- GE high density interconnect: a solution to the system interconnect problemPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Interfacial Studies on Cr and Ti Deposited on Benzocyclobutene (BCB) FilmMRS Proceedings, 1990
- Studies on the Surface Modification of Benzocyclobutene(BCB) Film By Plasma IonsMRS Proceedings, 1990
- Photoetching Of Polymers With Excimer LasersPublished by SPIE-Intl Soc Optical Eng ,1987
- The optical properties of bisphenol‐A polycarbonatePolymer Engineering & Science, 1987
- Interactions of excimer lasers with polymersAIP Conference Proceedings, 1987
- An x-ray photoelectron spectroscopy study of poly(methylmethacrylate) and poly(α-methylstyrene) surfaces irradiated by excimer lasersJournal of Vacuum Science & Technology A, 1986
- Optical absorption of some polymers in the region 240–170 nmApplied Physics Letters, 1986
- Dependence of photoetching rates of polymers at 193 nm on optical absorption depthApplied Physics Letters, 1986
- Laser Photoetching of PolymersMRS Proceedings, 1986