Interface behaviour evaluation in Au/Cr, Au/Ti and Au/Pd/Ti thin films by means of resistivity and stylus measurements
- 1 August 1976
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 36 (2), 343-347
- https://doi.org/10.1016/0040-6090(76)90028-6
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Observations on the aging of Ti-based metallizations in air/HCl environmentsThin Solid Films, 1973
- Termination materials for thin film resistorsProceedings of the IEEE, 1971
- Interconnection systems for solid-state components in hybrid integrated circuitsProceedings of the IEEE, 1971
- Metallization systems for silicon integrated circuitsProceedings of the IEEE, 1969