Strength of Gold-Plated Copper Leads on Thin Film Circuits Under Accelerated Aging
- 1 September 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (3), 202-205
- https://doi.org/10.1109/tphp.1975.1135064
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- X-ray study of interdiffusion in bimetallic Cu–Au filmsJournal of Applied Physics, 1972
- Mass diffusion in polycrystalline copper/electroplated gold planar couplesMetallurgical Transactions, 1972