Decomposition and interfacial reaction in brazing of SiC by copper-based active alloys
- 1 January 1992
- journal article
- research article
- Published by Springer Nature in Journal of Materials Science Letters
- Vol. 11 (9), 550-553
- https://doi.org/10.1007/bf00728605
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- High-resolution electron microscopy of a SiC/SiC joint brazed by a Ag-Cu-Ti alloyJournal of Materials Science, 1988
- The Cu−Si (Copper-Silicon) systemBulletin of Alloy Phase Diagrams, 1986