Deep ultraviolet laser etching of vias in polyimide films
- 24 July 1989
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 55 (4), 346-348
- https://doi.org/10.1063/1.101904
Abstract
A deep ultraviolet cw laser has been used to form vias in a polyimide film. The etched features have smooth sidewalls and high aspect ratios. The observations are consistent with an etching mechanism based on thermal decomposition.Keywords
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