Enhancement of Adhesion Between Cu Thin Film and Polyimide Modified by Ion Assisted Reaction
- 1 January 1997
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Ar+ ion irradiation in oxygen environment for improving wettability of polymethylmethacrylateJournal of Materials Research, 1996
- Surface chemical reaction between polycarbonate and kilo-electron-volt energy Ar+ ion in oxygen environmentJournal of Vacuum Science & Technology A, 1996
- X-ray photoelectron spectroscopy investigation of interfacial interactions in the Cr/BPDA-PDA and Ti/BPDA-PDA systemsJournal of Vacuum Science & Technology A, 1994
- Improving adhesion between thin chromium film and polyimide substrate by Ar+ irradiationPolymer Engineering & Science, 1992
- A study of modified polyimide surfaces as related to adhesionJournal of Vacuum Science & Technology A, 1990
- Esca and reels characterization of electrically conductive polyimide obtained by ion bombardment in the keV rangeSurface and Interface Analysis, 1988
- An XPS study of the composition of thin polyimide films formed by vapor depositionLangmuir, 1988
- Low-energy ion irradiation during film growth for reducing defect densities in epitaxial TiN(100) films deposited by reactive-magnetron sputteringJournal of Applied Physics, 1987
- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Large conductivity changes in ion beam irradiated organic thin filmsApplied Physics Letters, 1982