Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film Conductors

Abstract

Experiments have been undertaken to determine the length and width dependence of electromigration‐induced failure time in aluminum thin‐film conductors. A statistical model is presented and compared to the experimental data. The significance of the experimental data and the statistical model are discussed in terms of randomly distributed structural defects which produce flux divergences during electromigration.