MicroDAC strain measurement for electronics packaging structures
- 1 August 2001
- journal article
- Published by Elsevier in Optics and Lasers in Engineering
- Vol. 36 (2), 195-211
- https://doi.org/10.1016/s0143-8166(01)00034-3
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ InterferometryJournal of Electronic Packaging, 1995
- Thermal Deformations in Electronic PackagingPublished by Springer Nature ,1994
- Residual stress and thermal expansion of spun‐on polyimide filmsJournal of Applied Polymer Science, 1987