HVEM observations of stress-induced voiding in Al lines for LSI
- 2 November 1991
- journal article
- Published by Elsevier in Ultramicroscopy
- Vol. 39 (1-4), 306-312
- https://doi.org/10.1016/0304-3991(91)90210-w
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Voiding due to thermal stress in narrow conductor linesScripta Metallurgica, 1989
- A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallizationJournal of Vacuum Science & Technology B, 1987