Thin Film Wiring for Integrated Electronic Packages
- 1 January 1987
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Electrical Characterization of Packages for High-Speed Integrated CircuitsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
- Copper/polyimide Materials System for High Performance PackagingIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- The Thin-Film Module as a High-Performance Semiconductor PackageIBM Journal of Research and Development, 1982