Analysis of Multilayer Interconnection Lines for a High-Speed Digital Integrated Circuit
- 1 June 1985
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Microwave Theory and Techniques
- Vol. 33 (6), 527-532
- https://doi.org/10.1109/tmtt.1985.1133109
Abstract
No abstract availableKeywords
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