Study and development of an alkaline bath for copper deposition containing sorbitol as complexing agent and morphological characterization of the copper film
- 21 March 2005
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 192 (2-3), 145-153
- https://doi.org/10.1016/j.surfcoat.2004.09.011
Abstract
No abstract availableThis publication has 19 references indexed in Scilit:
- Nucleation and Growth of Copper on TiN from Pyrophosphate SolutionJournal of the Electrochemical Society, 2001
- Anodic electrodeposition of copper oxide/hydroxide films by alkaline solutions containing cuprous cyanide ionsJournal of Electroanalytical Chemistry, 2000
- Enhancing the adhesion of copper electroplates to steel substrates. Cyanide-free alkaline bathsProtection of Metals, 2000
- The role of pH and Cu(II) concentration in the electrodeposition of Cu(II) in NH4Cl solutionsJournal of Electroanalytical Chemistry, 1996
- Copper Deposition onto Au(111) in the Presence of ThioureaJournal of the Electrochemical Society, 1995
- Electroplating of Copper on Aluminium with Direct and Pulsed CurrentsCanadian Metallurgical Quarterly, 1994
- Electrodeposition of copper from sulphate and chloride solutionsElectrochimica Acta, 1989
- Selected Transport Properties of Some Electroless Copper Plating BathsJournal of the Electrochemical Society, 1988
- Kinetics of copper electrodeposition in citrate electrolytesJournal of Applied Electrochemistry, 1986
- Determination of the charge of complex species that are reduced at the dme and of the coefficient of transfer, α, in the Cu(II)aq. M citrate (M: Li+, Na+ and K+) systemElectrochimica Acta, 1984