Residual Thermoelastic Stresses in Bonded Silicon Wafers
- 1 March 1961
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 32 (3), 454-460
- https://doi.org/10.1063/1.1736024
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Properties of Silicon and GermaniumProceedings of the IRE, 1952
- Infra-Red Absorption in SiliconPhysical Review B, 1950