Diffusion induced grain boundary migration in thin gold/copper films
- 1 April 1985
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 33 (4), 579-586
- https://doi.org/10.1016/0001-6160(85)90022-7
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
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