Materials Limitations in the Higher Electronic Packaging Levels

Publisher Website

1 January 1987

journal article
Published by Springer Nature in MRS Proceedings

Vol. 108
https://doi.org/10.1557/proc-108-13

Abstract

No abstract available

Keywords

This publication has 2 references indexed in Scilit:

The Thin-Film Module as a High-Performance Semiconductor Package
IBM Journal of Research and Development, 1982
Effect of Scaling of Interconnections on the Time Delay of VLSI Circuits
IEEE Journal of Solid-State Circuits, 1982

Cited by 2 articles