Qualitative observations on the diffusion of copper and gold through a nickel barrier
- 1 May 1976
- journal article
- Published by Springer Nature in Metallurgical Transactions A
- Vol. 7 (5), 629-635
- https://doi.org/10.1007/bf03186793
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Mass diffusion in polycrystalline copper/electroplated gold planar couplesMetallurgical Transactions, 1972
- Self-diffusion and interdiffusion in gold-nickel alloysActa Metallurgica, 1957
- Diffusion of Gold into CopperJournal of Applied Physics, 1954