Stress Annealing in Vacuum Deposited Copper Films
- 1 October 1957
- journal article
- Published by IOP Publishing in Proceedings of the Physical Society. Section B
- Vol. 70 (10), 950-960
- https://doi.org/10.1088/0370-1301/70/10/305
Abstract
No abstract availableKeywords
This publication has 17 references indexed in Scilit:
- Stress Annealing in Copper FilmsJournal of Applied Physics, 1956
- Mechanical Strength of Thin Films of MetalsPhysical Review B, 1955
- A survey of irradiation effects in metalsAdvances in Physics, 1955
- Effect of Point Imperfections on the Electrical Properties of Copper. I. ConductivityPhysical Review B, 1955
- The Cause of Stress in Evaporated Metal FilmsProceedings of the Physical Society. Section B, 1954
- Distortion of a Crystal by Point ImperfectionsJournal of Applied Physics, 1954
- Lattice defects and the electrical resistivity of metalsAdvances in Physics, 1954
- Evidence for Collapse of Lattice Vacancy Aggregates to Form Dislocation RingsJournal of Applied Physics, 1953
- Thin Films of Ferromagnetic MaterialsReviews of Modern Physics, 1953
- Calculation of stress in electrodeposits from the curvature of a plated stripJournal of Research of the National Bureau of Standards, 1949