Micro-structuring of glass with features less than 100μm by electrochemical discharge machining
- 24 January 2009
- journal article
- Published by Elsevier in Precision Engineering
- Vol. 33 (4), 459-465
- https://doi.org/10.1016/j.precisioneng.2009.01.001
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Improving the machining efficiency in electrochemical discharge machining (ECDM) microhole drilling by offset pulse voltageJournal of Micromechanics and Microengineering, 2008
- 3D microstructuring of Pyrex glass using the electrochemical discharge machining processJournal of Micromechanics and Microengineering, 2007
- Improving machining performance of wire electrochemical discharge machining by adding SiC abrasive to electrolyteInternational Journal of Machine Tools and Manufacture, 2006
- Voltage pulse frequency and duty ratio effects in an electrochemical discharge microdrilling process of Pyrex glassInternational Journal of Machine Tools and Manufacture, 2005
- Physical principles and miniaturization of spark assisted chemical engraving (SACE)Journal of Micromechanics and Microengineering, 2005
- Machining of non-conducting materials using electrochemical discharge phenomenon—an overviewInternational Journal of Machine Tools and Manufacture, 2005
- Advances in micro ultrasonic assisted lapping of microstructures in hard–brittle materials: a brief review and outlookInternational Journal of Machine Tools and Manufacture, 2004
- Fabrication of high-density electrical feed-throughs by deep-reactive-ion etching of Pyrex glassJournal of Microelectromechanical Systems, 2002
- Contribution to the interpretation of the anode effectElectrochimica Acta, 1997
- Ceramic material processing by electrical discharge in electrolyteJournal of Materials Science, 1989