Review of multilayer ceramics for microelectronic packaging
- 1 January 1984
- journal article
- review article
- Published by Elsevier in Journal of Physics and Chemistry of Solids
- Vol. 45 (10), 1051-1068
- https://doi.org/10.1016/0022-3697(84)90048-9
Abstract
No abstract availableThis publication has 16 references indexed in Scilit:
- Multi-Layer Ceramics ManufacturingIBM Journal of Research and Development, 1983
- Cost/Performance Single-Chip ModuleIBM Journal of Research and Development, 1982
- Thermal Conduction Module: A High-Performance Multilayer Ceramic PackageIBM Journal of Research and Development, 1982
- Electronic Packaging Evolution in IBMIBM Journal of Research and Development, 1981
- A Multilayer Ceramic Multichip ModuleIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980
- Capillary-infiltrated conductors in ceramicsMetallurgical Transactions, 1971
- Refractory metallization of green ceramicMetallurgical Transactions, 1970
- Controlled Collapse Reflow Chip JoiningIBM Journal of Research and Development, 1969
- Solid Logic Technology: Versatile, High-Performance MicroelectronicsIBM Journal of Research and Development, 1964
- FABRICATION OF THIN CERAMIC SHEETS FOR CAPACITORS*Journal of the American Ceramic Society, 1947