Amorphous silicon deposition rates in diode and triode discharges
- 15 August 1986
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 60 (4), 1369-1373
- https://doi.org/10.1063/1.337312
Abstract
The relative rates of radical deposition on discharge electrodes and substrate surfaces are calculated for two-and three-electrode discharges. The reaction rate, diffusion coefficient, screen-electrode transparency, and surface sticking coefficient are parameters in the general solution. The parameters are then chosen to describe typical silane discharges used for a-Si:H photovoltaic production, and the effect of screen transparency and other parameters on substrate deposition rates is evaluated. We then show that a measurement of deposition rate versus screen–substrate spacing in a three-electrode discharge has been misinterpreted as due to gas reactions, whereas it is primarily due to screen deposition. Finally, we note some possibilities for measuring deposition parameters and for varying the mix of depositing species.Keywords
This publication has 3 references indexed in Scilit:
- Mono- and disilicon radicals in silane and silane-argon dc dischargesJournal of Applied Physics, 1986
- Gas-phase free radical reactions in the glow-discharge deposition of hydrogenated amorphous silicon from silane and disilaneJournal of Applied Physics, 1985
- Lifetime of dominant radicals for the deposition of a-Si:H from SiH4 and Si2H6 glow dischargesJournal of Non-Crystalline Solids, 1983