Back-scattering investigation of the low temperature stability of the aluminum-silver system
- 1 December 1973
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 19 (2), 349-358
- https://doi.org/10.1016/0040-6090(73)90071-0
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Low-temperature migration of silicon through metal films importance of silicon-;metal interfacePhysica Status Solidi (a), 1971
- MULTILAYER THIN-FILM ANALYSIS BY ION BACKSCATTERINGApplied Physics Letters, 1971
- LOW-TEMPERATURE MIGRATION OF SILICON IN THIN LAYERS OF GOLD AND PLATINUMApplied Physics Letters, 1971
- Diffusion in evaporated films of silver–aluminiumPhilosophical Magazine, 1968